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| PR IM EL SURFACE MOUNT ULTRA LOW VF SILICON SCHOTTKY DIODE TM TINY LEADLESS MODULE Y AR IN CTLSH05-2M521HL Central TM Semiconductor Corp. DESCRIPTION: The CENTRAL SEMICONDUCTOR CTLSH05-2M521HL is a high performance HiLoTM 0.5A Schottky diode designed for applications where small size and operational efficiency are the prime requirements. With a maximum power dissipation of 0.90W, and a very small package footprint (comparable to the SOT-563), this leadless package design is capable of dissipating over 3 times the power of similar devices in comparable sized surface mount packages. FEATURES: * HiLoTM Device Characteristics (High Current/Low VF) * Ultra Low Forward Voltage Drop (VF=0.39V Typ. @ 0.5A) * High Thermal Efficiency * Small TLM 2x1mm case TLM521 CASE MARKING CODE: CF APPLICATIONS: * DC/DC Converters * Voltage Clamping * Protection Circuits MAXIMUM RATINGS: (TA=25C) Continuous Reverse Voltage Average Forward Current Power Dissipation Peak Forward Surge Current (8.3ms) Operating and Storage Junction Temperature Thermal Resistance ELECTRICAL CHARACTERISTICS: SYMBOL IR BVR VF VF VF VF VF VF CT TEST CONDITIONS P E R LI IN M VR IF PD IFSM TJ, Tstg JA SYMBOL RY A 20 0.5 0.9 3.0 -65 to +150 139 MIN 20 0.030 0.065 0.145 0.235 0.280 0.390 TYP 0.2 * Battery Powered Portable Equipment UNITS V A W* A C C/W* (TA=25C unless otherwise noted) MAX 1.0 UNITS mA V 0.060 0.100 0.200 0.280 0.330 0.460 TBD V V V V V V pF VR=10V IR=1.0mA IF=100A IF=500A IF=10mA IF=100mA IF=200mA IF=500mA * FR-4 Epoxy PCB with copper mounting pad area of 33mm2. R0 (20-January 2006) Central TM Semiconductor Corp. P L RE F SILICON SCHOTTKY DIODE TM TINY LEADLESS MODULE IM SURFACE MOUNT ULTRA LOW V Y AR IN CTLSH05-2M521HL TLM521 CASE - MECHANICAL OUTLINE Suggested mounting pad layout for maximum power dissipation (Dimensions in mm) LEAD CODE: 1) 2) 3) 4) 5) CATHODE CATHODE CATHODE ANODE ANODE For standard mounting refer to TLM521 Package Details MARKING CODE: CF R0 (20-January 2006) |
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